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To recognize and highlight key industry achievements in advancing photonic integration through platform development, manufacturing, design, packaging and device characterization, PIC International magazine is proud to announce its PIC Awards programme.

With voting taking place online and presentations made at the PIC International 2017 networking dinner on the evening of March 7th in Brussels, the awards put the spotlight on innovation.

Nominations are open to all companies, individuals and organisations within the PIC community, and we encourage you all to take part. The awards programme is dedicated to celebrating leading lights in the industry and we would be delighted to hear from you.

PIC Platforms


This award recognises advances in the development and application of key materials systems driving today’s photonic integrated circuits and providing a stepping stone to future devices.



Advances in Manufacturing


Evolution in PIC production is helping to bring a new generation of devices into the market. This category celebrates the success stories so far.



Advances in Integration


This award recognises innovative approaches to packing more features into a chip and raising the bar to the next level.



Device Characterisation


Advances in tools, equipment and measurement know-how are bringing greater insight into chip-level performance; and go hand in hand with gains in device development and production. This award showcases the leading lights in this domain.



Design and Packaging


Equipment makers and chip designers are working ever closer to overcome the challenges of turning ideas into practical devices. In this category we celebrate the design and packaging solutions that have overcome major bottlenecks in the sector. 



Lifetime Achievement Award


Pioneers in photonic integration have helped make PICs a reality and their knowledge and expertise underpins major advances in the industry. This award recognises outstanding service to the sector.



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